The Japan Society of Vacuum and Surface Science (JVSS) will host the 18th International Symposium on Sputtering & Plasma Processes (ISSP2026) from 30 June to 03 July 2026 in Kyoto, Japan.
Click the poster below for more detailed information at ISSP2026 website. Abstract submission deadlines is 26 December 2025!
International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The 1st symposium was held in Tokyo, and the main subject was “Reactive Sputtering”. It was the time, some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively. This time, we focus on discussion towards a connected future. Physical meeting was successfully came back in 2024 in Kyoto and will be continued in 2026. Here are the subjected areas of ISSP2026;
- Fundamental of Sputtering and Plasma Processes
- Sputtering and Plasma Smart Process Technologies
- Pulsed Sputtering and HiPIMS
- Fundamentals of Thin Films Growth
- Functional Thin Films and Advanced Coatings
- Applied Research and Industrial Applications
This symposium has two features.
1. Program committee is formed mainly by members from related industries. Hence, the general tendency of papers presented in the symposium is practical use of the sputtering technology and industrial relevancy.
2. All the oral speakers including invited talks are requested to present also at the poster session. This system is giving unique opportunities for all personal attendees to discuss details of the oral presentations with speakers.
We strongly hope all the every engineers and researchers in all of the world working on the field of sputtering and plasma processes attend this exciting symposium.
We look forward to seeing you in enthusiastic traditional city KYOTO!
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