INVITATION TO SPONSORS

Dear Industrial Associates:

The 11th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2026) will take place from 13 to 17 July, 2026, in Singapore.

The biennial Thin Films conference started in 2002 with 70 papers and grew to 500 papers at “ThinFilms2006”, and to more than 800 papers at “ThinFilms2010”, and maintained at that scale in the several subsequent versions. This time we are expecting at least the same crowd, if not more. ThinFilms2026 will again bring together state-of-the-art developments on all aspects related to the processing, characterization and applications of thin films and surface coatings.

We believe that this is a good opportunity to showcase your latest processing and characterization equipment or apparatus to the researchers/engineers in this region and from the rest of the world. We thus invite you to participate in this exciting materials event in Singapore.

Various sponsorship packages (Click to download a copy of the Packages: in English version (invitation to sponsors) or 中文版《致赞助商和参展商》) have been designed to suit different needs for maximum impact at this event.

To sign up for the conference sponsorship/exhibition or for more information, please contact

Dr. QI Guojun,  Tel. +65-94554291; Email: [email protected] 

The sponsor’s response form (English version) or (中文版《赞助商参展商回执》) is also clickable to download for your convenience.

Looking forward to your active participation,

Yours truly,
Professor Sam Zhang
Chairman, ThinFilms2026