The 10th International Conference On Technological Advances Of Thin Films and Surface Coatings

Click HERE for a step-by-step registration guide.


Registration Guidelines

Important Notes to Authors/Presenters

Authors must complete their meeting registration and pay fees by 31 May 2024. Late payment may result in their Abstracts not being included in the Conference Program and other publications produced for distribution at the conference.

If circumstances prevent you from completing your registration and payment by 31 May 2024, you may request written permission from the Symposium Chair concerned to extend the payment deadline or be allowed to make payment onsite. Do note, however, that different registration rates will apply when you make the request and not every request can be acceded.

Participation will only be confirmed upon receipt of the online registration form and fee payment. If selecting “Student Registration”, you need to upload your student status proof (see item 5.0 below)

1) Register and Pay Online

Fees must be received in Singapore Dollars (SGD) only

RatesFull RegistrationStudent Registration
If Paid by 31 May 2024
SGD 980SGD 600
If Paid by 06 July 2024
SGD 1080SGD 650


2) Late/Onsite Registration and Payment

After 06 July 2024, only onsite registration and cash payment in SGD can be accepted.

Rates (Cash Only)Full RegistrationStudent Registration
If Paid After 06 Jul 2024
SGD 1,200SGD 790


3) Fees and Participation

How to register, pay, view and download payment records
3.1 Create a user account with the registration portal.
3.2 Login and click “Registration”.  Follow the given steps to complete the online form. Once completed,
(a) A Registration ID will be assigned. Invoice and payment instructions can be viewed online under “registration account”.
(b) You can pay fees immediately (recommended) or later. However, late fees will apply (if paid after 31 May 2024).
3.3 A receipt can only be issued after payment is cleared. You can view online and/or print your copy with your user account.
3.4 Online portal closes on 06 July 2024. After 06 July 2024, registration can only be entertained onsite.
3.5 Admission to the conference is on the condition that any fees owing to the conference (including late registration) must be paid onsite at the registration desk. Terms: Cash Only in Singapore Dollars.

4) Each Paid Registration Fee Covers One Paper/Presentation Only and Includes

4.1 For Full Registration
Program book
Welcome reception, coffee breaks and buffet lunches
One complimentary ticket to attend the conference banquet
See also notes below

4.2 For Student Registration
Program book
Welcome reception, coffee breaks and buffet lunches
Banquet ticket is NOT included in student registration
See also notes below

4.3 Notes
An additional registration fee is payable for each additional Paper/Presentation. Each (additional) banquet ticket costs SGD150.

5) Student Registration

If selecting this option, you must upload the student status proof.  This can be in the form of a letter issued by the school or a matriculation card. Without the student status proof, payment at student rates cannot be accepted. The proof document must be in English and should contain at least the following:

  1. Student name
  2. Student matriculation number (student ID with photo)
  3. Expiration date or Expected graduation date (this should be later than the conference date)
  4. University name

6) Registration Withdrawal / Cancellation Policies

6.1 Authors must register and pay by 31 May 2024 to have their Abstracts included in the conference program and any publications produced for distribution at the conference.
6.2 There will be no refund for withdrawal/cancellation notices received after 15 June 2024. For a notice received before 15 June 2024, an administration fee of SGD120 will apply.


7) Online Registration Payment Options

7.1 Credit Card: Paypal.

7.2 Telegraphic Transfer

7.3 Local Cheque/ Local Bank Transfer/ PayNow

Note: Admin fee for credit card payment processing and bank charge for other payment modes may apply.

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